2023 Innovation and Technology Support Programme (Platform & Seed) open for applications
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   The Innovation and Technology Commission is inviting applications for the 2023 Innovation and Technology Support Programme (ITSP) (Platform & Seed) from today (July 24) until October 27.
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    The ITSP (Platform & Seed) provides funding support for platform and seed research and development (R&D) projects undertaken by designated local public research institutes and R&D centres. Platform projects are applied R&D projects that are industry-oriented and have potential for commercialisation, while seed projects are exploratory and forward-looking projects.
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    Further information is available on the Innovation and Technology Fund (ITF) website (www.itf.gov.hk/en/funding-programmes/supporting-research/itsp/itsp-platform-seed/index.html). For enquiries, please contact the ITF Secretariat (Tel: 3655 5678; email: enquiry@itf.gov.hk).
